6-K 1 tsm-6k_20200811.htm 6-K tsm-6k_20200811.htm

 

 

 

 

 

 

 

 

 

 

 

1934 Act Registration No. 1-14700

 

 

 

 

 

 

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, DC 20549

 

 

 

FORM 6-K

 

 

 

REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER

THE SECURITIES EXCHANGE ACT OF 1934

 

 

 

For the month of August 2020

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

(Translation of Registrant’s Name Into English)

 

 

 

No. 8, Li-Hsin Rd. 6,
Hsinchu Science Park,
Taiwan, R.O.C.
(Address of Principal Executive Offices)

 

 

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F              Form 40-F  

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):

Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


 

 

 

SIGNATURES

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Taiwan Semiconductor Manufacturing Company Ltd.

Date:

August 11, 2020

By

/s/ Wendell Huang

 

 

 

 

Wendell Huang

 

 

 

 

Vice President & Chief Financial Officer

 

 



 

 

TSMC Board of Directors Meeting Resolutions

 

 

 

 

 

 

 

 

 

 

 

 

Hsinchu, Taiwan, R.O.C., Aug. 11, 2020 – TSMC (TWSE: 2330, NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:

 

1.   Approved the distribution of a NT$2.5 per share cash dividend for the second quarter of 2020, and set December 23, 2020 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be December 17, 2020. As required by Article 165 of Taiwan’s Company Law, the shareholders' register shall be closed for five days prior to the record date (December 19 through December 23, 2020) for registration transfer, and the dividend will be paid on January 14, 2021. In addition, the ex-dividend date for TSMC American Depositary Shares (ADSs) will be December 17, 2020. The record date for TSMC ADSs entitled to participate in this cash dividend distribution will be December 18, 2020.

 

2.   Approved capital appropriations of approximately US$5,271.6 million (approximately NT$152.9 billion) for purposes including: 1) Installation and expansion of advanced technology capacity; 2) Installation of specialty technology capacity; 3) Installation of advanced packaging capacity; 4) Fab construction, installation of fab facility systems, and capitalized leased assets; 5) Fourth quarter 2020 R&D capital investments and sustaining capital expenditures.

 

3.   Approved the issuance of US dollar-denominated unsecured corporate bonds for an amount not to exceed US$1 billion, and approved the provision of a guarantee to TSMC Global, a wholly-owned foreign subsidiary of TSMC, for its issuance of US dollar-denominated senior unsecured corporate bonds for an amount not to exceed US$3 billion, to finance TSMC’s capacity expansion.

 

4.   Approved the promotion of Business Development Vice President Dr. Kevin Zhang to Senior Vice President.

 

 

 

 

 

 

 

 

 


 

About TSMC

 

TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s largest dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

 

TSMC deployed 272 distinct process technologies, and manufactured 10,761 products for 499 customers in 2019 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.

 

 

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TSMC Spokesperson:

 

Media Contacts:

 

 

 

 

 

 

 

 

 

 

 

Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901

 

Nina Kao

Head of Public Relations

Tel: 886-3-5636688 ext.7125036

Mobile: 886-988-239-163

E-Mail: nina_kao@tsmc.com

 

Baker Li

Public Relations

Tel: 886-3-5636688 ext.7125037

Mobile: 886-988-932-757

E-Mail: baker_li@tsmc.com